Meet the recipients of the 2026 IEEE Medals—the group’s highest-level honors. Offered on behalf of the IEEE Board of Administrators, these medals acknowledge innovators whose work has formed trendy know-how throughout disciplines together with AI, training, and semiconductors.
The medals will probably be offered on the IEEE Honors Ceremony in April in New York Metropolis. View the complete listing of 2026 recipients on the IEEE Awards web site, and comply with IEEE Awards on LinkedIn for information and updates.
Sponsor: IEEE
Santa Clara, Calif.
“For management within the improvement of graphics processing items and their utility to scientific computing and synthetic intelligence.”
Sponsor: IBM
Pittsburgh
“For contributions to the development of societal enchancment and training via modern know-how.”
Sponsor: Nokia Bell Labs
College of California, Berkeley
“For contributions to Web structure, community useful resource allocation, and software-defined networking.”
Sponsor: Mani L. Bhaumik
Co-recipients:
Erik Dahlman
Stefan Parkvall
Johan Sköld
Stockholm
“For contributions to and management within the analysis, improvement, and standardization of mobile wi-fi communications.”
Sponsor: Google
Medford, Mass.
“For contributions to laptop imaginative and prescient and simulation algorithms, and for management in growing packages to advertise STEM careers.”
Sponsor: The Edison Medal Fund
“For pioneering contributions to biomedical imaging, terrestrial optical communications and networking, and inter-satellite optical hyperlinks.”
Sponsor: Toyota Motor Corp.
“For contributions to advancing electrical security within the office, integrating renewable power and grid modernization for local weather change mitigation.”
Sponsor: IEEE Basis
Reston, Va.
“For management in communication networks, together with acceleration of digital fairness, accountable Synthetic Intelligence, and the promotion of variety and inclusion.”
Sponsor: Qualcomm, Inc.
“For contributions to coding for dependable communications and networking.”
Sponsor: Mates of Nick Holonyak, Jr.
College of California, Santa Barbara
“For seminal contributions to compound semiconductor optoelectronics, together with high-efficiency seen light-emitting diodes, lasers, and LED shows.”
Sponsor: IEEE Engineering Drugs and Biology Society
“For pioneering contributions to wearable affective computing for well being and wellbeing.”
Sponsor: Apple
“For contributions to sign modeling, coding, and recognition for speech communication.”
Sponsor: ARM, Ltd.
“For the event of the recollision mannequin for sturdy area gentle–matter interactions resulting in the sector of attosecond science.”
Sponsor: IEEE Life Members Fund and MathWorks
James H. McClellan
“For basic contributions to electrical and laptop engineering training via modern digital sign processing curriculum improvement.”
Sponsor: IEEE Jun-ichi Nishizawa Medal Fund
Hanover, N.H.
“For the invention, improvement, and commercialization of the CMOS picture sensor.”
Sponsor: Intel Corp.
Santa Clara, Calif.
“For pioneering parallel computing architectures and management in semiconductor design that remodeled synthetic intelligence, scientific analysis, and accelerated computing.”
Sponsor: RTX
“For contributions to polarimetric artificial aperture radar imaging and its utilization.”
Sponsors: IEEE Business Purposes, Industrial Electronics, Energy Electronics, and Energy & Vitality societies
“For contributions to Z-Supply and modular multi-level converters for distribution and transmission networks.”
Sponsor: Northrop Grumman Corp.
LogiQ, Inc.
Arlington, Va.
“For management in nationwide safety, civil, and business methods engineering and improvement of chic design ideas.”
Sponsor: IBM
San Jose, Calif.
“For contributions to database question languages, notably Structured Question Language, which powers a lot of the world’s information administration and evaluation methods.”
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