#Factoftheweek
15-fold development.
The alternatives are countless with AI (synthetic intelligence), however provided that the know-how can deal with the workload, proper?
That is nonetheless a problem, particularly as the quantity of knowledge continues to develop exponentially.
Have you ever hit that reminiscence wall?
Parallel-computer architectures, similar to these deployed for contemporary high-performance computing and artificial-intelligence workloads, typically encounter reminiscence bottlenecks that restrict efficiency.
IDTechEx says this has stemmed from the advances in processor efficiency outpacing developments in reminiscence efficiency.
Enter high-bandwidth reminiscence.
HBM is a 3D construction of vertically stacked DRAM dies on high of a logic die and depends on superior packaging applied sciences similar to by silicon vias (TSVs) and makes use of silicon interposer for interconnection with the processor.
IDTechEx predicts unit gross sales of high-bandwidth reminiscence will develop 15-fold by 2035 in comparison with 2024.
In fact, there are challenges.
What roadblocks have you ever hit when attempting to do one thing new with synthetic intelligence? What options exist that may assist? Or what innovation may drive these alternatives?
View this story on LinkedIn.
The publish Reality of the Week – 4/7/2025 first appeared on Linked World.