F-572: Excessive-Efficiency Photonics Alignment System


Built-in 3- to 6-axis nanopositioning platform with ACS movement management accelerates energetic alignment processes. 

F-572: Excessive-Efficiency Photonics Alignment System
F-572, 6-DOF high-speed photonics alignment system for hundreds to 2 kg. Picture Credit score: PI (Physik Instrumente) LP

Physik Instrumente (PI), a worldwide chief in precision movement management and nanopositioning programs, introduces the F-572 Excessive-Efficiency 3- to 6-Axis Photonics Alignment System, designed for high-throughput energetic alignment purposes in photonics manufacturing and check.

The built-in system combines precision goniometers, linear nanopositioning levels, magnetic direct-drive know-how, high-resolution optical encoder suggestions, and a preconfigured ACS-based alignment controller. It supplies a compact, industrial-ready platform for demanding photonics purposes with payloads to 2 kg, together with superior packaging, LiDAR, and multichip-level testing.

A user-adjustable magnetic counterbalance on the Z-axis retains motor currents and warmth to a minimal.

The F-572 affords linear journey ranges of 60 mm in X, Y, and Z, whereas three precision goniometers with a typical pivot level present rotation ranges as much as 17 °. Excessive-speed magnetic direct drives allow linear velocities as much as 500 mm/s, and the goniometers assist angular velocities as much as 10 °/s. Minimal incremental movement is 5 nm and 5 µrad for linear and angular movement, respectively, with bidirectional repeatability of 150 nm and 25 µrad.

Embedded Quick Multi-Channel Alignment (FMPA) routines for fast space scans and gradient searches assist cut back alignment occasions and improve manufacturing throughput.

The included alignment controller options TCP/IP and EtherCAT interfaces, superior particular alignment routines and user-friendly software program. PI’s non-obligatory ultrafast PILightning algorithm is out there for accelerated first-light search purposes.

Industries and Purposes Served

Superior packaging, LiDAR, multichip-level testing, PIC alignment, fiber alignment, photonics check and meeting, optical element meeting, automated photonic wafer testing, photonics wafer probing

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